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 相關產品 |
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- Quick Lock Type BGA Socket
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Quick Lock IC Development Sockets
- Over View |
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Development socket
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SMT, thru hole or compression mount
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Bandwidths up to 3GHz (SMT)
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Bandwidths over 10GHz (compression mount)
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Integrated aluminum heatsink available
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Easy to remove IC retention lid
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For multiple device removals/insertions
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Low profile and mounts in IC's footprint (SMT
mount)
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Pitches down to 0.5mm (SMT and thru hole mount)
or 0.4mm (compression mount)
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Any grid
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 Quick
lock BGA Socket Data Sheet |
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MECHANICAL
DATA |
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Contact life:
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10,000 cycles min. |
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Retention System
life: |
10,000 cycles min. |
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Solderability:
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exceeds MIL-STD-202 Method
208 |
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Individual contact
force: |
40 grams max. |
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MATERIAL |
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Insulator (RoHS
Compliant): |
High temp plastic or epoxy
FR4 |
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Terminal (RoHS
compliant): |
Brass |
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Contact (RoHS
compliant): |
BeCu |
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ELECTRICAL
DATA |
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Contact resistance:
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< 100 mΩ |
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Current rating:
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500 mA max. |
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Insulation
resistance
at 500V DC: |
100 MΩ if 0.50 to 0.80mm
pitch
500 MΩ 1.00mm pitch upwards |
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Breakdown voltage
at 60 Hz: |
500V min. |
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Capacitance:
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< 1 pF |
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Inductance:
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< 2 nH |
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Operating
temperature: |
-55°C to +125°C ; 260°C for
60 sec. |
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These sockets are available for almost any
IC package style, size, lead-count and
lead-pitch down to 0.5mm pitch: BGA, MLF/QFN,
uBGA, SOIC, QFP and also custom packages or
die. Furthermore, these sockets provide
flexibility in the PCB mounting method: SMT,
raised SMT, through-hole, or compression
mount.
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SMT (pin type -30) uses a
standard reflow process to mount the
sockets to the target PCB. These sockets
mount in the same footprint as the IC,
but typically require a mimimum
clearance of 6mm betyond the package's
periphery. In situations where adjacent
components lie in this area, either the
socket body can be modified to clear the
components, or a special raised SMT
(pin types -28 or -29) pin can be used
in place of the standard SMT pin. These
pins raise the socket body from 2-5mm
above the PCB. Although this method does
not require any drilled holes in the
target PCB, it is highly recommended to
provide two such plated holes in order
to accomodate mounting pegs and greatly
strengthen the physical connection
between the socket and PCB.
Alternatively, epoxy can be used to
strengthen the connection, but this more
or less creates a permanent bond between
the socket and PCB.
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Through-hole (pin type -70)
requires plated holes to be drilled in
the PCB into which the pins of the
socket will be soldered. This provides
for a very robust and reliable
electrical and mechancial connection.
However, the electrical performance is
reduced due to the longer pin lengths.
This method is highly suitable for
burn-in applications.
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Compression (pin type -90) mount
removes the need for any soldering and
just requires the socket to be held to
the PCB via screws. The benefit of this
method is that it allows the customer to
easily attach the socket to the target
board in the lab, without the extra
cost, lead-time, and potential problems
caused by sending the board to an
assembly house. However, this method
requires that the target PCB has
mounting holes drilled to accomodate the
mounting screws and socket body
alignment posts. Furthermore, depending
on the size of the IC, the PCB
thickness, etc., a backing plate is
required to provide rigidity and ensure
the socket pins contact the PCB pads.
This plate can usually be modified to
accomodate any backside compononents.
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SOCKET BODY VERTICAL OFFSET
The following table shows the vertical
clearance of the socket body from the PCB.
This is only applicable to the SMT mounting
style. In situations where the clearance is
insufficient, or the standard SMT pin is
preferred, it is possible to modify the
socket body to accomodate for adjacent
components.
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Pitch |
Vertical Offset Using Special Raised
SMT
(-28)
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Vertical Offset Using Raised SMT
(-29)
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Vertical Offset Using Standard SMT
(-30)
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0.50-0.75 |
N/A |
2.3 |
0.4 |
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0.8 |
4.5 |
2.8 |
0.6 |
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1.00 |
4.5 |
3.2 |
0.8 |
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1.27 |
N/A |
5.0 |
1.2 |
Dimensions in mm
FEATURES & BENEFITS
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Easily exchange ICs in your system
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High bandwidth: 3GHz @ -1dB
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Available for any IC package style: BGA,
uBGA, CSP, QFN/MLF, LGA, PGA, SOIC, QFP,
custom or die
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Any lead count, grid and package size
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Minimum 0.5mm lead pitch
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Maximum 40g force per contact
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Mounts to same PCB footprint as the IC
(no holes required for SMT version)
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Low profile: <10mm high with IC
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Minimal keepout area: approx. 6mm beyond
ICs periphery
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Raised SMT version available for lifting
socket over adjacent components
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Heat dissipation integrated heatsink
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Thermal expansion, shock & vibration
absorbed by contact design
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LGA contact design can also be used for
board-to-board connections
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Standard-process design & manufacturing
= lower cost and tailored to your needs
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